Electronics assemblies and methods of manufacturing electronics assemblies with improved thermal performance

ABSTRACT

Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

FIELD OF THE DISCLOSURE

The present disclosure generally relates to cooling electronics devices,and, more particularly, to electronics assemblies and methods ofmanufacturing electronics assemblies with improved thermal performance.

BACKGROUND

Electronics packages are used to provide protection, support, andconnections for one or more electronic components therein. However,electronics packages feature one or more components, e.g., dies, thatgenerate heat. This heat can, in turn, negatively affect the performanceof the one or more electronic components, and, more generally, theelectronics package itself. Accordingly, various techniques have beendeveloped that aim to improve thermal performance by dissipating heatfrom the one or more heat generating components of these electronicspackages.

FIG. 1 illustrates one of these techniques, whereby an electronicspackage in the form of a socketed CPU 100 is equipped with an integratedheat spreader 104. While difficult to see in FIG. 1, the integrated heatspreader 104 is in thermal contact with a die of the socketed CPU 100,such that heat generated by the die is transferred to the integratedheat spreader 104. This heat is then dissipated via one or more heatsinks that, while not shown in FIG. 1, are spring loaded on theintegrated heat spreader 104 in order to achieve a low thermalresistance between the integrated heat spreader 104 and the one or moreheat sinks.

FIGS. 2 and 3 illustrate another one of these techniques, whereby aspring-loaded heat sink 200 is installed on an electronics package inthe form of a flip chip ball grid array (FCBGA) 204 that is soldered toa printed circuit board (PCB) 208 via solder balls (not shown). In turn,the spring-loaded heat sink 200 dissipates heat generated by a die ofthe FCBGA 204.

The problem with these and other techniques is that spring-loaded heatsinks such as the spring-loaded heat sink 200 introduce forces andtherefore mechanical stresses into the electronics packages and, atleast in the case of the technique of FIGS. 2 and 3, into the PCB 208and the solder balls connecting the FCBGA 204 to the PCB 208 as well. Insome cases, it is necessary to install a back plate 400 on the rear sideof the PCB 208 in order to strengthen the area and reduce mechanicalstresses on the solder balls, the FCBGA 204, and the PCB 208, as isillustrated in FIG. 4.

However, even when a back plate such as the back plate 400 is installedon the rear side of the PCB 208, the solder balls will eventually beginto crack in response to the mechanical stresses introduced by thespring-loaded heat sink 200. Over time, these cracks will cause thesoldered connection between the FCBGA 204 and the PCB 208 to fail.

SUMMARY

In accordance with a first exemplary aspect, an electronics assembly isdisclosed. The electronics assembly includes a printed circuit board(PCB) including one or more cutouts. The electronics assembly alsoincludes an electronic device and a heat spreader arranged to dissipateheat generated by the electronic device. The heat spreader includes abase surface and one or more legs extending outwardly from the basesurface, each of the legs having an end portion soldered in a respectivecutout of the one or more cutouts.

In accordance with a second exemplary aspect, an electronics assembly isdisclosed. The electronics assembly includes a printed circuit board(PCB) and an integrated circuit package mounted to the PCB. Theintegrated circuit packing having a heat generating component. Theelectronics assembly also includes a heat spreader soldered to the PCBsuch that the heat spreader is thermally coupled to the heat generatingcomponent of the integrated circuit package to dissipate heat generatedby the heat generating component.

In accordance with a third exemplary aspect, a method of manufacturingan electronics assembly is disclosed. The method includes obtaining aprinted circuit board (PCB). The method also includes mounting anintegrated circuit package to the PCB, the integrated circuit packagehaving a heat generating component. The method further includessoldering a heat spreader to the PCB such that the heat spreader isthermally coupled to the heat generating component to dissipate heatgenerated by the heat generating component.

In further accordance with any one or more of the foregoing first,second, or third exemplary aspects, an electronics assembly and/ormethod of manufacturing an electronics assembly may include any one ormore of the following further preferred forms.

In one preferred form, the PCB further includes one or more solder padsdisposed in the one or more cutouts. The end portions can be soldered toa respective solder pad.

In another preferred form, each of the legs of the heat spreader curvesoutward from the base surface.

In another preferred form, the PCB further includes one or morerestricted areas surrounding the one or more cutouts, respectively.

In another preferred form, the electronic device includes an electronicspackage mounted to the PCB. The electronics package has a heatgenerating component, and the heat spreader is thermally coupled to theheat generating component to dissipate heat generated by the heatgenerating component.

In another preferred form, the electronic device includes an electronicspackage mounted to the PCB, the electronics package including a flipchip ball grid array (FCBGA) and the heat generating component comprisesa die of the FCBGA.

In another preferred form, the integrated circuit package includes aflip chip ball grid array (FCBGA) and the heat generating componentcomprises a die of the FCBGA.

In another preferred form, the heat spreader includes a base surface anda plurality of legs extending outwardly from the base surface. The PCBcan further include a plurality of cutouts, and the legs can be solderedto a respective cutout of the plurality of cutouts.

In another preferred form, the heat spreader includes a base surface anda plurality of legs extending outwardly from the base surface, each ofthe legs having an end portion soldered to the PCB.

In another preferred form, the PCB further includes a plurality ofcutouts, and the end portions are soldered in a respective cutout of theplurality of the cutouts.

In another preferred form, the PCB further includes a plurality ofsolder pads disposed in the plurality of cutouts, and the end portionsare soldered to a respective solder pad.

In another preferred form, the heat spreader is thermally coupled to theheat generating component via a thermal interface material disposedtherebetween.

In another preferred form, the electronics assembly further includes amagnet assembly configured to align the heat spreader relative to theintegrated circuit package. The magnet assembly has a first magnetadapted to be coupled to the heat spreader, and a second magnet adaptedto be coupled to the integrated circuit package.

In another preferred form, prior to soldering the heat spreader to thePCB, the heat spreader can be positioned in a desired position relativeto the heat generating component.

In another preferred form, positioning the heat spreader in the desiredposition can include coupling a first magnet to the integrated circuitpackage and a second magnet to the heat spreader, the second magnetmagnetically attracted to the first magnet.

In another preferred form, the heat spreader is soldered to the PCBwhile the first magnet is coupled to the integrated circuit package andthe second magnet is coupled to the heat spreader. After the heatspreader is soldered to the PCB, the first magnet can be removed fromthe integrated circuit package and the second magnet can be removed fromthe heat spreader.

In another preferred form, obtaining the PCB includes forming one ormore cutouts in the PCB, and soldering the heat spreader to the PCBincludes disposing one or more legs of the heat spreader within the oneor more cutouts, respectively, and soldering one or more end portions ofthe one or more legs within the one or more cutouts.

In another preferred form, prior to soldering the heat spreader to thePCB, a thermal interface material is applied to the heat generatingcomponent.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a known electronics package with an integrated heatspreader for dissipating heat generated by the electronics package.

FIG. 2 illustrates another known electronics package.

FIG. 3 illustrates a known heat sink for dissipating heat generated bythe electronics package of FIG. 2.

FIG. 4 illustrates another known electronics package that is similar tothe electronics package of FIG. 2 but also includes a back plate coupledthereto.

FIG. 5 illustrates an electronics assembly constructed in accordancewith the teachings of the present disclosure.

FIG. 6 illustrates a printed circuit board (PCB) and an electronicspackage of the electronics assembly of FIG. 5, showing that the PCBincludes a plurality of cutouts.

FIG. 7 is a close-up of view of a portion of the PCB, showing one of thecutouts, a solder pad disposed in the cutout, and a restricted areasurrounding the cutout.

FIG. 8 illustrates a heat spreader of the electronics assembly of FIG.5.

FIG. 9 is a close-up of a portion of FIG. 5, showing one of the legs ofthe heat spreader disposed within one of the cutouts of the PCB.

FIG. 10 is similar to FIG. 9.

FIG. 11 is an exploded view of the electronics assembly of FIG. 5, butalso including a magnet assembly for use in properly positioning theheat spreader relative to the electronics package.

FIG. 12 is a schematic diagram of one example of a method or process ofmanufacturing an electronics assembly in accordance with the teachingsof the present disclosure.

DETAILED DESCRIPTION

FIGS. 5-11 Illustrate an example of an electronics assembly 500constructed in accordance with the teachings of the present disclosure.The electronics assembly 500 generally includes a printed circuit board(PCB) 504, an electronics package 508 mounted to the PCB 504, and a heatspreader 512 generally arranged relative to the PCB 504 and theelectronics package 508 to dissipate heat generated by the electronicsassembly 500. More particularly, the heat spreader 512 is soldered tothe PCB 504 in an optimal position relative to the electronics package508 such that the heat spreader 512 is thermally coupled to one or moreheat generating components of the electronics package 508 to effectivelyand efficiently dissipate heat generated by the heat generatingcomponents. Beneficially, the heat spreader 512 effectively andefficiently dissipates heat generated by the heat generating componentsof the electronics package 508 without imparting any mechanical stresson the electronics package 508, the PCB 504, or other components of theelectronics assembly 500.

In this example, the PCB 504 takes the form of a 136 circuit board thatincludes or is formed of any number of electronics components known inthe art. In other examples, however, the PCB 504 may take the form of adifferent circuit board. The PCB 504 in this example also generallyincludes one or more cutouts 516 formed therein and one or more solderpads 520 disposed in the one or more cutouts 516, respectively. The oneor more cutouts 516 are generally arranged and sized to receive one ormore corresponding portions of the heat spreader 512, such that thecutouts 516 are generally arranged (e.g., spaced apart from one another)in a manner that corresponds to the shape and size of the heat spreader512. Meanwhile, the one or more solder pads 520 are configured tofacilitate soldering of the corresponding portions of the heat spreader512 to the PCB 504. As best illustrated in FIGS. 6 and 7, the PCB 504 inthis example includes four cutouts 516 and four solder pads 520 disposedin the four cutouts 516 (only one solder pad 520 is illustrated, in FIG.7). In other examples, however, the PCB 504 may include one cutout 516or two, three, or more than four cutouts 516. Preferably, and asillustrated in FIG. 7, the PCB 504 further includes a restricted area524 surrounding each of the cutouts 516, respectively. Each restrictedareas 524 does not include any vias, traces, or other electronicscomponents, thereby providing one or more buffer areas that allow theheat spreader 512 to be soldered to the PCB 504 without damaging anyelectronic components of the PCB 504. In other examples, however, thePCB 504 may not include any restricted areas 524, and in some examples,the PCB 504 may include one or more vias and/or traces immediatelyadjacent one or more of the cutouts 516.

The electronics package 508 is generally configured to provideprotection, support, and connections for one or more electroniccomponents therein that connect the electronics package 508 to the PCB504. In this example, the electronics package 508 takes the form of anFCBGA that is soldered to the PCB 504 via a plurality of solder balls(not shown). Thus, in this example, the one or more heat generatingcomponents include a die 528 centrally located within the FCBGA. Inother examples, however, the electronics package 508 can take the formof a different type of integrated circuit package (e.g., an organicpin-grid array, a pin array cartridge, a pin-grid array, or a ceramicpin-grid array) and/or the integrated circuit package can be mounted tothe PCB 504 using a method other than soldering. In the illustratedexample or those other examples, the one or more heat generatingcomponents may alternatively or additionally include other heatgenerating components. As an example, the one or more heat generatingcomponents may include a resistor. As another example, the one or moreheat generating components may include a cover (e.g., a plastic cover, ametal cover) thermally coupled to the die 528 (e.g., via a thermalinterface material).

It follows that in this example, the heat spreader 512 is configured todissipate heat generated by the die 528 of the FCBGA 508. To this end,the heat spreader 512 generally has a base surface 532 that is thermallycoupled to the die 528. The base surface 532 illustrated in FIGS. 5 and8 has a generally rectangular shape, though it will be appreciated thatthe base surface 532 can instead have a circular, triangular, hexagonal,irregular, or other shape. The base surface 532 is, at least in thisexample, thermally coupled to the die 528 via a thermal interfacematerial, e.g., a thermal grease, a thermal paste, or a thermal pad,disposed between the die 528 and the base surface 532, which in turnhelps to reduce the thermal resistance between the die 528 and the basesurface 532 (and the heat spreader 512 more generally).

As illustrated in FIGS. 5 and 8, the heat spreader 512 in this examplealso generally has one or more legs 536 that extend outwardly from thebase surface 532 and terminate at one or more end portions 540,respectively. Because the PCB 504 in this example includes four cutouts516, the heat spreader 512 in this example likewise includes four legs536 that terminate at four end portions 540 that are soldered within thefour cutouts 516 of the PCB 504. As best illustrated in FIG. 5 and FIGS.9 and 10, which depict one of the legs 536 and its respective endportion 540, the end portions 540 are soldered within the plurality ofcutouts 516 of the PCB 504 via the plurality of solder pads 520. Thefour legs 536 curve outwardly from opposite corners of the base surface532. Of course, in other examples, e.g., when the PCB 504 includes moreor less than four cutouts 516, the heat spreader 512 can include more orless than four legs 536. Moreover, each of the legs 536 can extendoutward from the base surface 532 at a different angle. As an example,each of the legs 536 can be substantially straight, such that the legs536 are perpendicular to the base surface 532.

It will be appreciated that the incorporation of the one or more cutouts516 into the PCB 504 helps to thermally decouple the base surface 532,which is thermally coupled to the die 528 and not directly soldered tothe PCB 504, from the one or more legs 536, which are directly solderedto the PCB 504 via the end portions 540, respectively. In turn, thisallows the base surface 532 to be made of or manufactured from ametallic material having a higher thermal conductivity than wouldotherwise be permitted, as metallic materials having higher thermalconductivities are generally harder to solder than those that have lowerthermal conductivities (i.e., thermal conductivity is generallyinversely related to solderability). The base surface 532 is preferablymade of a sheet metal with a higher thermal conductivity, such as, forexample, copper, steel, nickel, tin, or a metal alloy. In some cases,the base surface 532 can be partially or entirely surface treated with asurface material (e.g., gold, nickel, or tin) that is compatible withthe metallic material of the base surface 532, can be soldered, and alsois thermally conductive. Meanwhile, depending upon which material(s)is(are) used to manufacture the base surface 532, the one or more legs536 can be made of or manufactured from the same material(s) or one ormore other materials.

However, while the heat spreader 512 is fixedly attached to the PCB 504by soldering the one or more legs 536 of the heat spreader 512 withinthe one or more cutouts 516 of the PCB 504, it will be appreciated thatthe heat spreader 512 can be fixedly attached to the PCB 504 in adifferent manner. As an example, the heat spreader 512 can be fixedlyattached to the PCB 504 by soldering the one or more legs 536 of theheat spreader 512 directly to the PCB 504 (in which case the PCB 504need not include any cutouts 516). As another example, the heat spreader512 can be glued to the PCB 504 instead of soldered. Also, the heatspreader 512 can be milled or die casted.

Optionally, the electronics assembly 500 can also include a magnetassembly 550 configured to ensure the heat spreader 512 is aligned with(e.g., optimally positioned relative to) the PCB 504 and the electronicspackage 508, and more particularly the die 528, before the heat spreader512 is soldered to the PCB 504. The optimal position of the heatspreader 512 will generally vary depending upon the height of the die512, the parallelism (or lack thereof) of the heat spreader 512 relativeto the electronics package 508, the heat generation distribution of thedie 528, and/or one or more other factors which are a result ofmanufacturing tolerances. In one example, the heat spreader 512 will beoptimally positioned relative to the die 528 when the heat spreader 512is centered about the die 528. In another example, the heat spreader 512will be optimally positioned relative to the die 528 when the surfacearea contact between the heat spreader 512 and the thermal material ismaximized (or when there is any contact at all between the heat spreader512 and the thermal material). In other examples, the optimal positionmay further vary.

In any event, the magnet assembly 550 in this example includes a first,or bottom, magnet 558 and a second, or top, magnet 554 that ismagnetically attracted to the first magnet 558. The first magnet 558 isadapted to be coupled to the electronics package 508 and, moreparticularly, a bottom side of the PCB 504 (which is in turn mounted tothe package 508), while the second magnet 554 is adapted to be coupledto the heat spreader 512 and, more particularly, a top side of the basesurface 532. Thus, when the heat spreader 512, with the second magnet554 coupled thereto, is positioned in proximity to the electronicspackage 508 and the first magnet 558 coupled thereto, a magneticattraction is formed between the first and second magnets 558, 554. Thismagnetic attraction not only ensures that the heat spreader 512 isoptimally positioned relative to the die 528 (e.g., if the heat spreader512 is not in the optimal position, the magnetic attraction will forcethe heat spreader 512 into the optimal position), but can be used tohold the heat spreader 512 in this optimal position while the heatspreader 512 is soldered to the PCB 504 in the arrangement describedabove, all without introducing any mechanical stress into the solderballs used to solder the heat spreader 512 to the PCB 504.

In other examples, other means may be employed to ensure the heatspreader 512 is aligned with (e.g., optimally positioned relative to)the PCB 504 and the electronics package 508, and more particularly thedie 528, before the heat spreader 512 is soldered to the PCB 504. In onesuch example, a single magnet may be used. More particularly, a singlemagnet that is magnetically attracted to the heat spreader 512 (andvice-versa) may be coupled to the bottom side of the PCB 504 (which isin turn mounted to the package 508). In turn, when the heat spreader 512is positioned in proximity to the package 508 and the magnet coupledthereto, a magnetic attraction is formed between the magnet and the heatspreader, and this magnetic attraction can serve the same purpose as themagnetic attraction discussed above. In another such example, one ormore weights and/or one or more springs can be coupled to the heatspreader 512 and/or the PCB 504 to hold the heat spreader 512 in theoptimal position while the heat spreader 512 is soldered to the PCB 504.

Optionally, the electronics assembly 500 can also include a heat sink,e.g., the spring-loaded heat sink 200. The heat sink is generallythermally coupled to the heat spreader 512 in order to facilitatedissipation of the heat generated by the die 528 and transferred to theheat spreader 512. In some examples, the heat sink is thermally coupledto the heat spreader 512 via a thermal material, e.g., a thermal grease,a thermal paste, or a thermal pad, disposed between the heat sink andthe heat spreader 512.

FIG. 12 depicts an example of a method or process 1200 for manufacturingan electronics assembly such as the electronics assembly 500. The methodor process 1200 is performed in the order shown and described herein,but may be implemented in or according to any number of differentorders. The method or process 1200 may, in other examples, includeadditional, fewer, or different acts.

The method 1200 first includes the act of obtaining a printed circuitboard (PCB), e.g., the PCB 504 (block 1204). In some examples, obtainingthe PCB may include manufacturing the PCB, but in other examplesobtaining the PCB may include retrieving an already manufactured PCB. Insome examples, obtaining the PCB may include forming one or more cutouts(e.g., the cutouts 516) in the PCB. In other examples, the provided PCBmay already include the one or more cutouts or may not include anycutouts at all.

The method 1200 then includes the act of mounting an integrated circuitpackage (e.g., the integrated circuit package 508) to the PCB (block1208). The integrated circuit package generally includes a heatgenerating component such as a die (e.g., the die 528). In someexamples, the integrated circuit package is mounted to the PCB bysoldering (e.g., using a surface mount soldering process, a wavesoldering processor any other known soldering process).

The method 1200 further includes the act of soldering a heat spreader(e.g., the heat spreader 512) to the PCB (block 1212). The heat spreadercan be soldered to the PCB using a surface mount soldering process, awave soldering processor any other known soldering process. In someexamples, e.g., when the PCB includes cutouts, the act of solderingincludes disposing one or more legs (e.g., legs 536) of the heatspreader within the one or more cutouts, respectively, and soldering endportions (e.g., end portions 540) of the one or more legs within the oneor more cutouts. In any event, the heat spreader is soldered to the PCBsuch that the heat spreader is thermally coupled to the heat generatingcomponent to dissipate heat generated by the heat generating component.

In some examples, the method 1200 may further include, prior tosoldering the heat spreader to the PCB, applying a thermal interfacematerial (e.g., thermal grease) to the heat generating component.Alternatively or additionally, the method 1200 may further include,prior to soldering the heat spreader to the PCB, positioning the heatspreader in a desired position relative to the heat generating componentand holding the heat spreader in the desired position. In some examples,the heat spreader may be moved to the desired position and held in thatdesired position using a magnet assembly (e.g., the magnet assembly550). In one example, using the magnet assembly includes coupling afirst magnet (e.g., the magnet 558) to the integrated circuit packageand a second magnet (e.g., the magnet 554) to the heat spreader, thesecond magnet being magnetically attracted to the first magnet. In thisexample, the heat spreader may be soldered to the PCB while the firstmagnet is coupled to the integrated circuit package and the secondmagnet is coupled to the heat spreader, thereby ensuring that the heatspreader is soldered in the desired position relative to the heatgenerating component. After the heat spreader is soldered to the PCB,the first magnet can be removed from the integrated circuit package andthe second magnet can be removed from the heat spreader. In otherexamples, the heat spreader can be positioned in the desired positionrelative to the heat generating component and held in the desiredposition using a single weight, one or more weights, and/or one or moresprings.

In some examples, the method or process 1200 may also includemanufacturing any of the components described herein. As an example, themethod or process 1200 may include the act of manufacturing the PCB, theintegrated circuit package, and/or the heat spreader. Manufacturing canbe performed using a conventional manufacturing technique and/or anadditive manufacturing technique. The additive manufacturing techniquemay be any additive manufacturing technique or process that buildsthree-dimensional objects by adding successive layers of material on amaterial. The additive manufacturing technique may be performed by anysuitable machine or combination of machines. The additive manufacturingtechnique may typically involve or use a computer, three-dimensionalmodeling software (e.g., Computer Aided Design, or CAD, software),machine equipment, and layering material. Once a CAD model is produced,the machine equipment may read in data from the CAD file and layer oradd successive layers of liquid, powder, sheet material (for example) ina layer-upon-layer fashion to fabricate a three-dimensional object. Theadditive manufacturing technique may include any of several techniquesor processes, such as, for example, a stereolithography (“SLA”) process,a fused deposition modeling (“FDM”) process, multi-jet modeling (“MJM”)process, and a selective laser sintering (“SLS”) process. In someembodiments, the additive manufacturing process may include a directedenergy laser deposition process. Such a directed energy laser depositionprocess may be performed by a multi-axis computer-numerically-controlled(“CNC”) lathe with directed energy laser deposition capabilities.

Preferred embodiments of this invention are described herein, includingthe best mode or modes known to the inventors for carrying out theinvention. Although numerous examples are shown and described herein,those of skill in the art will readily understand that details of thevarious embodiments need not be mutually exclusive. Instead, those ofskill in the art upon reading the teachings herein should be able tocombine one or more features of one embodiment with one or more featuresof the remaining embodiments. Further, it also should be understood thatthe illustrated embodiments are exemplary only, and should not be takenas limiting the scope of the invention. All methods described herein canbe performed in any suitable order unless otherwise indicated herein orotherwise clearly contradicted by context. The use of any and allexamples, or exemplary language (e.g., “such as”) provided herein, isintended merely to better illuminate the aspects of the exemplaryembodiment or embodiments of the invention, and do not pose a limitationon the scope of the invention. No language in the specification shouldbe construed as indicating any non-claimed element as essential to thepractice of the invention.

The invention claimed is:
 1. An electronics assembly, comprising: aprinted circuit board (PCB) comprising two or more cutouts; anelectronic device; and a heat spreader arranged to dissipate heatgenerated by the electronic device and comprising a base surface and twoor more legs extending outwardly from the base surface, each of the legshaving an end portion soldered in a respective cutout of the two or morecutouts, wherein the PCB further comprises two or more solder padsdisposed in the two or more cutouts, respectively, and wherein the endportions are soldered to a respective solder pad.
 2. The electronicsassembly of claim 1, wherein each of the legs curves outward from thebase surface.
 3. The electronics assembly of claim 1, wherein the PCBfurther comprises two or more restricted areas surrounding the two ormore cutouts, respectively.
 4. The electronics assembly of claim 1,wherein the electronic device comprises an electronics package mountedto the PCB, the electronics package having a heat generating component,wherein the heat spreader is thermally coupled to the heat generatingcomponent to dissipate heat generated by the heat generating component.5. The electronics assembly of claim 4, wherein the electronics packagecomprises a flip chip ball grid array (FCBGA) and the heat generatingcomponent comprises a die of the FCBGA.
 6. The electronics assembly ofclaim 1, further comprising a magnet adapted to be coupled to theelectronic device or the heat spreader to align the heat spreaderrelative to the electronic device.
 7. The electronics assembly of claim1, further comprising a magnet assembly configured to align the heatspreader relative to the electronic device, the magnet assembly having afirst magnet adapted to be coupled to the heat spreader and a secondmagnet adapted to be coupled to the electronic device.
 8. An electronicsassembly, comprising: a printed circuit board (PCB); an integratedcircuit package mounted to the PCB, the integrated circuit packinghaving a heat generating component; a heat spreader soldered to the PCBsuch that the heat spreader is thermally coupled to the heat generatingcomponent of the integrated circuit package to dissipate heat generatedby the heat generating component; and a first magnet adapted to becoupled to the integrated circuit package or the heat spreader to alignthe heat spreader relative to the integrated circuit package.
 9. Theelectronics assembly of claim 8, wherein the integrated circuit packagecomprises a flip chip ball grid array (FCBGA) and the heat generatingcomponent comprises a die of the FCBGA.
 10. The electronics assembly ofclaim 8, wherein the heat spreader comprises a base surface and aplurality of legs extending outwardly from the base surface, wherein thePCB further comprises a plurality of cutouts, and wherein the legs aresoldered to a respective cutout of the plurality of cutouts.
 11. Theelectronics assembly of claim 8, wherein the heat spreader comprises abase surface and a plurality of legs extending outwardly from the basesurface, each of the legs having an end portion soldered to the PCB. 12.The electronics assembly of claim 11, wherein the PCB further comprisesa plurality of cutouts, and wherein the end portions are soldered in arespective cutout of the plurality of the cutouts.
 13. The electronicsassembly of claim 12, wherein the PCB further comprises a plurality ofsolder pads disposed in the plurality of cutouts, and wherein the endportions are soldered to a respective solder pad.
 14. The electronicsassembly of claim 8, wherein the heat spreader is thermally coupled tothe heat generating component via a thermal interface material disposedthere between.
 15. The electronics assembly of claim 8, furthercomprising a magnet assembly configured to align the heat spreaderrelative to the integrated circuit package, the magnet assembly havingthe first magnet and a second magnet, the first magnet adapted to becoupled to the heat spreader and the second magnet adapted to be coupledto the integrated circuit package.